NEBNext® Ultra™ End Repair/dA-Tailing Module

This product was discontinued on December 15, 2022. An alternative product is the NEBNext® Ultra II End Repair/dA-Tailing Module (NEB #E7546).

  • Catalog # E7442 was discontinued on December 15, 2022
This module is part of the original Ultra™ workflow, and is optimized for use with the NEBNext® Ultra Ligation Module (NEB #E7445), for Illumina®-compatible library construction. The original Ultra workflow enables library preparation from 5 ng – 1 μg of input DNA in a streamlined protocol. 

However, we now recommend use of the more recent NEBNext Ultra II DNA workflow, which has been further optimized to provide increased yields of high quality libraries from a broader range of input amounts (500 pg – 1 μg), and a NEBNext Ultra II End Repair/dA-Tailing Module (NEB #E7546) is available.
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