NEBNext® Fill-in and ssDNA Isolation Module

  • Catalog # E6071 was discontinued on January 01, 2013
  • Product Information
    The NEBNext® Fill-in and ssDNA Isolation Module has been optimized to fill in adapter sequence from a nick generated by ligation of adaptors lacking a 5´-phosphate to a DNA template coupled with ssDNA isolation. Bst DNA Polymerase, Large Fragment, recognizes the nick resulting from the ligation of unphosphorylated adapters, displaces the nicked strand and extends the 3´ end of the DNA template and fills in the adapter sequence to generate full length dsDNA. Hydrophilic Streptavidin Magnetic Beads and buffers are provided to allow binding of dsDNA fragments bearing one biotinylated adapter prior to adapter fill-in and elution of the full length, unbiotinylated ssDNA strands after adapter fill-in.

    The NEBNext® Fill-in and ssDNA Isolation Module is provided as a master mix to maximize efficiency and convenience in DNA sample preparation workflows (1,2,3). The NEBNext Fill-in and ssDNA Isolation Module has been validated by sequencing with the Roche 454 GS FLX Titanium in conjunction with the NEBNext End Repair Module, and the NEBNext Quick Ligation Module.

    This product is related to the following categories:
    Discontinued Products
    • Advantages and Features
    • Properties & Usage
    • Related Products
    • Product Notes
    • References
  • Protocols, Manuals & Usage
  • Citations & Technical Literature
    • Citations
  • Quality, Safety & Legal
    • Quality Control Assays
    • Safety Data Sheets
    • Legal and Disclaimers
Loading Spinner